This review explores the intersection of bio-plausible artificial intelligence in the form of Spiking Neural Networks (SNNs) with the analog In-Memory Computing (IMC) domain, highlighting their collective potential for low-power edge computing environments. Through detailed investigation at the device, circuit, and system levels, we highlight the pivotal synergies between SNNs and IMC architectures. Additionally, we emphasize the critical need for comprehensive system-level analyses, considering the inter-dependencies between algorithms, devices, circuit & system parameters, crucial for optimal performance. An in-depth analysis leads to identification of key system-level bottlenecks arising from device limitations which can be addressed using SNN-specific algorithm-hardware co-design techniques. This review underscores the imperative for holistic device to system design space co-exploration, highlighting the critical aspects of hardware and algorithm research endeavors for low-power neuromorphic solutions.

The amount of data processed in the cloud, the development of Internet-of-Things (IoT) applications, and growing data privacy concerns force the transition from cloud-based to edge-based processing. Limited energy and computational resources on edge push the transition from traditional von Neumann architectures to In-memory Computing (IMC), especially for machine learning and neural network applications. Network compression techniques are applied to implement a neural network on limited hardware resources. Quantization is one of the most efficient network compression techniques allowing to reduce the memory footprint, latency, and energy consumption. This paper provides a comprehensive review of IMC-based Quantized Neural Networks (QNN) and links software-based quantization approaches to IMC hardware implementation. Moreover, open challenges, QNN design requirements, recommendations, and perspectives along with an IMC-based QNN hardware roadmap are provided.

Spiking Neural Networks (SNNs) have recently attracted widespread research interest as an efficient alternative to traditional Artificial Neural Networks (ANNs) because of their capability to process sparse and binary spike information and avoid expensive multiplication operations. Although the efficiency of SNNs can be realized on the In-Memory Computing (IMC) architecture, we show that the energy cost and latency of SNNs scale linearly with the number of timesteps used on IMC hardware. Therefore, in order to maximize the efficiency of SNNs, we propose input-aware Dynamic Timestep SNN (DT-SNN), a novel algorithmic solution to dynamically determine the number of timesteps during inference on an input-dependent basis. By calculating the entropy of the accumulated output after each timestep, we can compare it to a predefined threshold and decide if the information processed at the current timestep is sufficient for a confident prediction. We deploy DT-SNN on an IMC architecture and show that it incurs negligible computational overhead. We demonstrate that our method only uses 1.46 average timesteps to achieve the accuracy of a 4-timestep static SNN while reducing the energy-delay-product by 80%.

Fully-analog in-memory computing (IMC) architectures that implement both matrix-vector multiplication and non-linear vector operations within the same memory array have shown promising performance benefits over conventional IMC systems due to the removal of energy-hungry signal conversion units. However, maintaining the computation in the analog domain for the entire deep neural network (DNN) comes with potential sensitivity to interconnect parasitics. Thus, in this paper, we investigate the effect of wire parasitic resistance and capacitance on the accuracy of DNN models deployed on fully-analog IMC architectures. Moreover, we propose a partitioning mechanism to alleviate the impact of the parasitic while keeping the computation in the analog domain through dividing large arrays into multiple partitions. The SPICE circuit simulation results for a 400 X 120 X 84 X 10 DNN model deployed on a fully-analog IMC circuit show that a 94.84% accuracy could be achieved for MNIST classification application with 16, 8, and 8 horizontal partitions, as well as 8, 8, and 1 vertical partitions for first, second, and third layers of the DNN, respectively, which is comparable to the ~97% accuracy realized by digital implementation on CPU. It is shown that accuracy benefits are achieved at the cost of higher power consumption due to the extra circuitry required for handling partitioning.

With the widespread use of Deep Neural Networks (DNNs), machine learning algorithms have evolved in two diverse directions -- one with ever-increasing connection density for better accuracy and the other with more compact sizing for energy efficiency. The increase in connection density increases on-chip data movement, which makes efficient on-chip communication a critical function of the DNN accelerator. The contribution of this work is threefold. First, we illustrate that the point-to-point (P2P)-based interconnect is incapable of handling a high volume of on-chip data movement for DNNs. Second, we evaluate P2P and network-on-chip (NoC) interconnect (with a regular topology such as a mesh) for SRAM- and ReRAM-based in-memory computing (IMC) architectures for a range of DNNs. This analysis shows the necessity for the optimal interconnect choice for an IMC DNN accelerator. Finally, we perform an experimental evaluation for different DNNs to empirically obtain the performance of the IMC architecture with both NoC-tree and NoC-mesh. We conclude that, at the tile level, NoC-tree is appropriate for compact DNNs employed at the edge, and NoC-mesh is necessary to accelerate DNNs with high connection density. Furthermore, we propose a technique to determine the optimal choice of interconnect for any given DNN. In this technique, we use analytical models of NoC to evaluate end-to-end communication latency of any given DNN. We demonstrate that the interconnect optimization in the IMC architecture results in up to 6$\times$ improvement in energy-delay-area product for VGG-19 inference compared to the state-of-the-art ReRAM-based IMC architectures.